主要规格及技术指标

高精度双面电路板激光加工系统，无须化学腐蚀；附带可X、Y方向移动的真空吸附
台及摄像头重定位系统，用于样品制作和小批量生产。
compact Lasersystem for chemical free, high precise structuring of circuit boards
with xy-vacuum table and autofocus camera for the production of Prototyps and
small series .
激光加工幅面/Working area of the Laser： 305 x 229 mm x 7mm
包括/Consisting of:
* 半导体泵浦激光器/diode pumped laser
* 激光安全防护外罩/laser housing
* 可X/Y向移动的工作台/xy-table
* 工作台附带真空吸附功能，用于固定板材/vacuum table for base material
* CCD 摄像头重定位装置，具有靶标识别功能
visionsystem, camera supported positioning system with fiducial recognition

主要功能及特色

在实验室试制高精度的射频微波电路板以及天线样品。可制作数字，模拟，数模混合电路板；也可加工射频微波电路板；可以刻制铝质，塑料面板，铭牌，可以刻制聚酰亚胺柔性材料，在微波电路上挖盲槽；可以准确控制深度雕铣材料，对已装配元件的电路板进行修理、分切，可以点胶或点焊锡膏。
Prototype high-precision RF microwave circuit boards and antenna samples in the laboratory. Digital, analog, digital-analog hybrid circuit boards and RF microwave circuit boardscan also be processed; aluminum, plastic panels, nameplates can be engraved, polyimide flexible materials can be engraved, blind slots can be dug on microwave circuits; depth engraving and milling materials can be accurately controlled, and the circuit boards of assembled components can be repaired and slitted, and can be dispensed or spot solder paste.

主要附件及配置

无