主要规格及技术指标

•机台尺寸 820Wx620Lx710H(mm)
•机台重量 约100kg
•芯片传送模式 Manual Load/Unload
•芯片尺寸 6”x1 pcs or handle 4"&3"&2"wafer
•温度使用范围 RT~800℃(K-TYPE);
800~1250℃(Pyrometer)
•升温率 <=30C/sec for SiC
•温度均匀性 >500℃ @±1%
<=500℃@±5℃
•温度重现性 ±2℃
•制程气体 MFC1 N2 100SLM
MFC2 N2 10SLM
MFC3&MFC4预留接口
•加热灯源 29 pieces 1.5KW of Halogen Lamp
•In-Line 温度监测 K type Thermal Couple(0~800℃)
Pyrometer(800~1200℃)

•Machine size 820Wx620Lx710H (mm)
•Machine weight About 100kg
•Chip transmission mode Manual Load/Unload
•chip size 6”x1 pcs or handle 4"&3"&2"wafer
•Temperature usage range RT~800℃(K-TYPE);
800~1250℃(Pyrometer)
•super-heating rate <=30C/sec for SiC
•temperature homogeneity >500℃ @±1%
<=500℃@±5℃
•Temperature repeatability ±2℃
•Process gas MFC1 N2 100SLM
MFC2 N2 10SLM
MFC3 & MFC4 reserved interfaces
•Heat the lamp 29 pieces 1.5KW of Halogen Lamp
•In-Line temperature monitoring K type Thermal Couple(0~800℃)
Pyrometer(800~1200℃)

主要功能及特色

•双层钨丝卤素石英灯管加热。
•10区灯管温控系统以提供较好的温度均匀性。
•实时闭回路温度控制。
•每支灯管皆具加热电流侦测功能以监控制程状态。
•三阶用户权力以区分操作、维护及管理功能差异。
•制程稳定性自动侦测警示机能。
•Window based 图控接口配合触控面板及机台信息与操控于一 身。
•每 一 次的制程信息系统均会以该 Lot-ID 及时间自动存盘。
•多重电路互锁回路来确保系统的安全性。

•The double tungsten filament halogen quartz lamp tube is heated by mouth.
•The temperature control system of the 10-zone lamp tube in the mouth provides better temperature uniformity.
•Oral real-time closed loop temperature control.
•Each lamp tube has a heating current detection function to monitor the process status.
•The three levels of user power are used to distinguish the differences in operation, maintenance and management functions.
•Automatic detection and warning function of process stability.
•The port Window based the control interface is combined with the touch panel and machine information and control in one body.
•Each time the process information system is automatically saved with the Lot-ID and time.
•The multiple circuit interlock circuit is used to ensure the safety of the system.

主要附件及配置

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