主要规格及技术指标

1. Catman Easy Math software package
2. QuantumX MX1615B Strain amplifier
3. 1-LY41-1.5/120 Strain gauge
4. 1-RF95-1/120ZE Strain gauge
5. QuantumX Power supply device
6. Ethernet cables
7. MX1615 Module connector
8. 1-LS7 Welding terminals
9. 1silicone cover SG250
10. 200 cleaning pads 50 x 50mm
11. 100cm³ cleaning agent RMS 1
12. Support welding pen
13. lead-free solder
14. Measurement cable 4-wire, PFA, 20 meters
15. cold cured strong adhesive Z70

1.Catman Easy Math软件包
2.QuantumX MX1615B应变放大器
3.1-LY41-1.5/120应变计
4.1-RF95-1/120ZE应变计
5.QuantumX电源装置
6.以太网电缆
7.MX1615模块连接器
8.1-LS7焊接端子
9.1硅胶盖SG250
10.200个50 x 50mm的清洁垫
11.100cm³清洁剂RMS 1
12.支焊笔
13.无铅焊料
14.测量电缆4线，PFA，20米
15.冷固化强力胶Z70

主要功能及特色

1. Perform strain stress testing on printed circuit boards to prevent malfunctions caused by mechanical loads, and to prevent additional errors in certain electronic components or sensors during the testing process
2. In some specific application scenarios, PCB and electronic components are analyzed and tested, such as preventing SMD capacitors from breaking due to increased bending stress in the production process, preventing excessive force on the test probe during ICT testing, and detecting thermal effects (cracks caused by thermal expansion, as well as different values of the shell, heat sink, printed circuit board, and electronic components), which facilitates the optimization of manufacturing processes
3. Used catman AP DAQ software for testing

1.对印刷电路板进行应变应力测试，以防止机械负载引起的故障，并防止在测试过程中某些电子元件或传感器出现额外错误
2.在一些特定的应用场景中，对PCB和电子元件进行分析和测试，例如防止SMD电容器在生产过程中因弯曲应力增加而断裂，防止ICT测试过程中测试探针受到过大的力，检测热效应（热膨胀引起的裂纹，以及外壳、散热器、印刷电路板和电子元件的不同值），这有助于优化制造工艺
3.使用catman AP DAQ软件进行测试

主要附件及配置

无