主要规格及技术指标

1. Galvanometer Speed: ≤4000mm/s
2. Acceleration: ≤10000mm/s²
3. Positioning Accuracy: ±3μm
4. Repeatability: ±2μm
5. Repetition Frequency: 100 kHz - 2 MHz
6. Pulse Width: <15 ps
7. Spot Mode: TEM00 (M2 < 1.3)

1. 振镜速度：≤4000mm/s
2. 加速度：≤ 10000mm/s²
3. 定位精度：±3um
4. 重复精度：±2um
5. 重复频率：100KHz-2MKz
6. 脉冲宽度：＜15ps
7. 光斑模式：TEMOO (M2<1.3)

主要功能及特色

This equipment is used for cutting various cover films (PET, PI, PC), FPCs, polarizers, conductive fabrics, double-sided tapes, thin stainless steel, copper and aluminum foils, etc. The laser processing system is stable, easy to operate, ensuring good dynamic quality of the system. The equipment has an aesthetically pleasing appearance, and a reasonable structure.
1. Utilizes an ultrashort pulse laser, offering high processing efficiency, minimal heat-affected zones, and eliminating the need for subsequent auxiliary treatments, achieving a "cold" processing technique.
2. Features a marble platform and a linear motor drive system, ensuring precise and stable high-speed platform operation.
3. Incorporates a high-speed laser galvanometer system for rapid processing, enhancing production efficiency.
4. Equipped with a high-quality picosecond ultraviolet laser generator and optical system, featuring full optical path protection to ensure long-term stable machine operation.

本设备用于各种覆盖膜类（PET、PI、PC）、FPC、偏光片、导电布、双面胶、薄不锈钢、铜铝箔等切割。设备激光加工系统稳定，操作方便，保证系统具有良好的动态品质，设备外观造型美观，结构合理。
1.采用超短脉冲激光器，具有加工效率高，热影响区小，无需后续辅助处理等优点，可以达到“冷”加工工艺。
2.采用大理石平台，直线电机驱动系统，确保平台高速运行的精准度和稳定性。
3.高速激光振镜系统，加工速度快，提升生成效率。
4.优质的皮秒紫外激光发生器与光学系统，全光路保护，以确保机器长时间稳定工作。

主要附件及配置

The laser cutting system includes a motion platform, screw motion modules, a processing table, and an optical system.
1. Laser: Yinggu/Huari Picosecond Ultraviolet, 30W, with 355nm output wavelength.
2. Laser Cutting Head: Customized High-Speed Galvanometer Cutting Head
3. Operating System: Customized Cutting Specialized Software
4. Industrial PC: Advantech 510
5. Rack: Sheet Metal
6. Adsorption Device: Integrated (High Negative Pressure) Vacuum Pump
7. Chiller: Teyu, High Precision ±0.1°C
激光切割系统包含运动平台、丝杆运动模组、加工台面、光路系统。
1. 激光器：英谷/华日皮秒紫外30W，输出波长355nm
2. 激光切割头：定制高速振镜切割头
3. 操作系统：定制切割专用软件
4. 工控机：研华510
5. 机架：钣金
6. 吸附装置：一体式（高负压）真空泵
7. 冷水机：特域，高精度±0.1℃。