主要规格及技术指标

1 The number of cleaning chamber is 2, with solid platforms set on both sides of the chamber, elevated 2 cm above the surface.
2 The chamber material is PVDF, with a thickness of 10 mm and dimensions of 460*210*220 (mm).
3 The liquid inlet method is through a faucet with bottom injection, operated manually.
4 The liquid level monitoring function is activated, with dual-level detection for both upper and lower levels.
5 The process temperature is a maximum of 80 degrees Celsius, heated by a heating plate with a power of 6 kW. The time to reach 80 degrees is less than or equal to 30 minutes, using SCR for precise temperature control.
6 The liquid discharge method is gravity discharge, with a discharge pipe diameter of 3/4".
7 The alarm system includes low-pressure alarms (CDA/N2 low-pressure alarms will stop the machine), dry burn safety alarms (each area is equipped with a heater that stops heating after a high-temperature alarm), and liquid leak alarms (all actions will stop after a leak alarm occurs in any area)

1 清洗区数量为2个，槽体两侧设置实心平台，高出平面2cm
2 槽体材质为PVDF，厚度10mm，尺寸460*210*220（mm）
3 进液方式为水龙头加底部注水，手动操作
4 液位监测功能开启，上下双液位检测
5 工艺温度为最高80度，通过加热板加热，加热板功率6kW，升温到80度时间为小于等于30分钟，使用SCR精准控温
6 液体排放方式为重力排放，排放管径3/4"
7 报警系统，平日被低压报警（CDA/N2低压报警后停机），空烧安全报警（每区配有加热器高温报警后停止加热），漏液报警（每区发生漏液报警后停止所有动作）

主要功能及特色

This cleaning system is mainly used for the cleaning process of 6-inch and smaller chip manufacturing.
The electrical hardware of this cleaning system uses a Siemens control system and a proface touchscreen. In terms of software, functions such as independent operation and low water alarm have been added to enhance the system based on the actual usage conditions at our university, ensuring stable and safe operation. The main features include:
(1) A more intuitive human-machine interface, allowing general operations to be performed directly from the main interface.
(2) Multiple safety protection measures to ensure the safety of operators.
(3) A real-time monitoring system that monitors electrical components, cable contacts, and other aspects of the machine in real-time.

本清洗系统主要用于6 英寸及以下芯片制造的清洗工艺。
本清洗系统电气硬件方面采用西门子控制系统，Proface 触摸屏。软件方面，针对我校使用的实际情况，增加了独立操作，缺水报警等功能提升，保证稳定安全运行，主要特色有
（1）采用更加直观的人机界面，一般需求只需在主界面即可操作生产。
（2）多种安全防护措施，确保操作人员人身安全。
（3）实时监控系统，对机器电气部件、线缆触点等进行实时监控。

主要附件及配置

无